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The following topics are dealt with: materials and processing; quality and reliability; electrical modeling; optoelectronics; advanced packaging; manufacturing technology; microsystems packaging; thermal-mechanical modeling; passive components; and emerging technologies
The need for faster, smaller, and more reliable and efficient products has resulted in increase of heat generated in microelectronic components. The removal of the heat generated is an important issue in electronic packaging. The present research work aims at developing a new class of nano-thermal interface material (nanoTIM) that has low thermal resistance, high thermal conductivity and mechanical...
Nanoparticles of Sn-4.0Ag-0.5Cu and Sn-0.4Co-0.7Cu (wt% composition) lead free solder alloys were manufactured and characterized for potential applications in microelectronics packaging. Scanning electron microscopy (SEM) analysis was carried out in order to study the morphology and size distribution of the nanoparticles. It was observed that nanoparticles of lead free alloys were almost spherical...
Besides the plating process solder paste printing is the most commonly applied production method to electrically connect components and carrier systems. This technology is a proven and stabilized technology serving a worldwide spectrum of applications. The continuously proceeding demand for miniaturization of components, PCBs and completed modules seems to be opposite to the request on larger scale...
The use of carbon fibres in composite materials is reported for laminate materials used in electronics packaging. The effective medium theory is described for this application and used to estimate the effective complex permittivity of the laminate and hence produce a theoretical shielding effectiveness for the material. To validate this work experimental methods are discussed using the waveguide simulator...
The paper focuses on electron microscopy investigations of board assembly for a new XFLGA package with emphasis on microstructure, intermetallic compound (IMC) and defect formation in solder to package and board metallization interfaces. XFLGA packages with NiAu lead finish were assembled using a commercial SnAg3.5Cu0.7 solder to NiAu- or CuOSP board metallization. The interface microstructure was...
The purpose of this paper was to investigate the effect of thermal cycling on the high frequency behavior of a BGA transition structure. A broadband microwave BGA transition structure between a RF-PWB and a ceramic module was designed and fabricated. The stand-off height of the composite BGA solder joints was 500 mum. The BGA test modules mounted on the PWBs were exposed to thermal cycling testing...
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